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U-MAP Co., Ltd.

U-MAP Co., Ltd.

Nagoya

Other(Material)

About

U-MAP was established to bring advanced thermal conductivity materials developed by Professor Ujihara's lab at Nagoya University to market. One of the world's leading material science researchers, Prof Ujihara's lab has developed a innovative heat conduction additive for use in ceramics, resins, rubber, and other materials. Known as Thermality, this material has rigorous patent protection and on-going research creates continuously improved formulations. The company's on-going affiliation with the lab at Nagoya University ensures that its materials will remain at the leading edge of thermal conductivity performance. U-Map's proprietary material - Thermality - brings many performance advantages. Using only a quarter of the amount as compared to normal thermal conductivity additives, it provides up to 4x the heat conduction capability. It also provides increased tensile strength, reduced brittleness, and extended thermal tolerance. When it comes to meeting the demanding requirements of thermal management in modern devices from phones to cars, Thermality is the right additive to optimize performance.

Founders



Toru Ujihara CTO
Kenji Nishitani CEO
Takahiro Maeda COO
Ayano Kita International Strategy Manager

Product



Thermality


Though aluminum nitride (AlN) whisker-filled material, known to control the thermal path of electronic machines at will, is expected to save enormous energy by eliminating cooling mechanisms, it was hard to mass synthesize. They established a highly efficient method and made the new material.

Achievement in alliance

One of the difficulties of our business is that we have a long supply chain. We are now working with component manufacturers to create sample and sell them to substrate manufacturers. But in order to get the substrate manufacturers to buy these materials, we need to gain the understanding of the module manufacturers, who are the substrate manufacturers' customers. So, as our next approach, we would like to make connections with module manufacturers and want to do PoCs with them. Specifically, we are thinking of using the materials in EVs.

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